Home > News > Ultra-Thin Gate-Insulation Process for Advanced CMOS Transistors
May 26th, 2004
Ultra-Thin Gate-Insulation Process for Advanced CMOS Transistors
Abstract:
STMicroelectronics today announced that ST, CEA-Leti and AIXTRON have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes. The new process significantly reduces transistor leakage current by the deposition of 'high-k' gate-insulation material.
Source:
Businesswire
Related News Press |
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||