Home > News > Applied Materials launches 45nm copper barrier/seed technology
December 1st, 2004
Applied Materials launches 45nm copper barrier/seed technology
Abstract:
The system is fully qualified and slated for 65nm production by a major chipmaker.
Source:
eetimes
Related News Press |
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||