Home > News > ASM Intl. & IMEC demonstrate 3 generations of Aurora® low-k materials
December 5th, 2006
ASM Intl. & IMEC demonstrate 3 generations of Aurora® low-k materials
Abstract:
In this strategic partnership, IMEC and ASM will develop novel copper/low-k interconnects on 300mm wafers for application in chips of the nanotechnology era, with feature sizes of 45nm or less. "The Aurora materials are known for their superior mechanical properties," comments Tominori Yoshida, ASM's Business Unit Manager for PECVD.
Source:
marketwire.com
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