Home > Press > CEA-Leti Ramps up 300mm Line Dedicated to 3D-Integration Applications
Abstract:
Tomorrow, CEA-Leti is inaugurating its 300mm line dedicated to 3D integration applications.
This 300mm line is unique in Europe and will allow Leti to meet its customer's demands in 3D integration.
CEA-Leti, a recognized leader in 3D integration R&D, will significantly expand its technology offering this month when it ramps up one of Europe's first 300mm lines dedicated to 3D-integration applications.
By adding this technology to its existing 300mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200mm and 300mm wafers.
The new line, dedicated to R&D and prototyping, includes 3D-oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's customers and partners around the world.
It will allow Leti to apply its 3D-integration generic processes on 300 mm wafers. This 3D toolbox includes a large portfolio of through-silicon vias (TSVs), and advanced capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks and building efficient advanced-systems solutions. This will be done in close collaboration with local design and characterization platforms.
"This extension offers important new capabilities to equipment manufacturers and other Leti partners," said Laurent Malier, CEO of Leti. "Together we will demonstrate 3D and heterogeneous integration technologies on 300mm wafers."
####
About CEA-Leti
CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families.
For more information, please click here
Contacts:
CEA-Leti
André Rouzaud
04.38.78.39.22
Agency
Amélie Ravier
+33 1 58 18 59 30
Copyright © CEA-Leti
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Related News Press |
News and information
Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024
Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||